How shot size, travel speed and machine setup control the profile a shot blaster leaves, plus magnets, dust collection and edges.
A shot blaster throws steel shot at the slab, recovers it, and throws it again, removing laitance and thin coatings and leaving a uniform profile. You control the result with two things: the size of the shot and how fast you walk.
Shot blasting releases respirable crystalline silica. Run it with a matched dust collector and follow OSHA 1926.1153.[7] See Silica dust and respiratory safety.
Shot blasting is a mid-range profile method. Under ICRI 310.2R, shot blasting can produce CSP 2 to 9[2]; one manufacturer's guide narrows that to CSP 3 to 7.[5] See ICRI CSP profiles for what those numbers mean.
Bigger shot hits harder and leaves a deeper profile. This is the shot guide for the National A95, an 8" blaster.[1]
| Goal | Shot |
|---|---|
| Brush blast, penetrating sealer | S-280 to S-330 |
| Worn surfaces, tile mastic, urethane, epoxy | S-330 |
The A95 isn't recommended for urethane over 10 mil or for removing 1/8" or more of concrete.[1] Always check your machine's manual for the shot sizes it's built for.
A light profile takes a faster travel speed than a coarse one.[3] Start with a lower feed rate, and don't stop mid-pass or you'll leave ridges.[4] Do a test pass and compare it to CSP chips before running the whole floor.
A few setup steps make the machine work properly from the first pass.
Blasters don't reach the wall.
These cause most uneven blast patterns.
These are the blaster and shot we stock.
Linked PDF documents are archived copies saved by PreFloor Tools so they stay available if the publisher moves or removes them. Check the publisher's website for the latest revision.
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